5 Design Rules For Ceramics
Exceptions include the weakly bonded nacl table salt and strongly bonded.
5 design rules for ceramics. Cost efficiency for high volumes high packaging density reliability integrated and embedded passives component capacitors inductors. Almost all advanced ceramics have very high compressive stress capabilities but only a few have high tensile stress capabilities. Ltcc low temperature co fired ceramic parameters. I r insulation resistance 100 v dc 1012 meg ohms.
Thermal expansion of ltcc 25 c 300 c 5 8ppm c. Do not eat or drink when working with ceramic materials. When using solvent containing ceramic materials. Ceramics 5 1 21 2004 melting temperature melting temperature is very closely related to strength of atomic bonding and thus the melting temperatures of ionic and covalently bonded ceramics tends to be higher than for metals and polymers as shown in table 1 2 below.
Use the dust collector at all times. Wear a dust mask at all times. Df dissipation factor 10 mhz 0 15. So keep your area.
Sweep floor when finished. Ltcc shrinkage x y 12 2 z 15. Design for compressive stresses. Where possible reduce the section thickness of the component only use the ceramic where it is doing ceramic work.
Ltcc low temperature co fired ceramic. The ten golden rules of ceramics 1 clay must be thoroughly covered up with plastic to keep it from drying out. Ltcc design rules for engineering assistance in ltcc and information please contact minicaps contact. Clean all mixers by sponging out and sweep floor thoroughly when finished.
2 clay dust is harmful to breathe in if you are exposed to it for long periods of time because it contains silica. Use a smock when working with ceramic materials or wash clothes after. This applies to works in progress and wet clay. Start studying 5 golden rules of ceramics.
Where possible avoid tensile and bending stresses. Ceramic breakdown voltage v 25µm 1000v. Wear personal protective equipment at all times while working in the clay mixing room and be exceptionally careful in cleaning up after mixing. Ltcc r6 0 012 space between line to ltcc edge and 0 014 via pad to ltcc edge recommended 0 006 via go to.
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